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  1. JP-listed companies
  2. HIRAKAWA HEWTECH CORP.
  3. Financials
  4. Dividend payout ratio (%)

HIRAKAWA HEWTECH CORP. (5821)

Market cap
¥75.1B
P/E ratio
19.1x
Heikawa Hutech makes electric wires, cables, and electronic components for industries from automotive to medical, plus specializes in optical broadcasting equipment.
SummaryFinancialsDividendsHistoryOwnershipWorkforce
Period EndDividend payout ratio (%) (Million JPY)YoY (%)

Income Statement

RevenueRevenue growth (%)Cost of revenueGross profitGross margin (%)Research & developmentSelling, general & administrativeOperating margin (%)Operating expenses Operating income Income before tax Pretax margin (%)Provision for income taxesEffective tax rate (%)Net income Net income margin (%)Earnings per shareDiluted EPSDividend payout ratio (%)Dividend per shareEBITDAEBITDA margin (%)

Balance Sheet

Cash and cash equivalents Marketable securities, current Total cash & short-term investmentsAccounts receivable, netInventoriesTotal current assetsProperty, plant and equipment, netMarketable securities, non-current Total non-current assetsTotal assets Accounts payableShort-term debtLong-term debt, current Total current liabilitiesLong-term debt, non-current Total non-current liabilitiesTotal liabilities Common stock and paid-in capital Retained earningsStockholders' equityTotal debtNet debtD/E ratio (%)Working capital

Cash Flow

Depreciation & amortizationStock-based compensationCash from operations Capital expendituresCash from investing Payments for dividends Repurchases of common stockProceeds from issuance of term debt, netRepayments of term debtCash from financing Free cash flowFCF margin (%)
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