HIRAKAWA HEWTECH CORP. (5821) Dividends

Market cap
¥78.4B
P/E ratio
20x
Heikawa Hutech makes electric wires, cables, and electronic components for industries from automotive to medical, plus specializes in optical broadcasting equipment.

Latest Dividend per Share Forecast

47.00JPY

Dividend Grower

If you buy 100 shares of HIRAKAWA HEWTECH CORP., the expected annual dividend is 4,700 JPY.

Dividend Yield
1.1%
Payout Ratio
30.1%

Dividend Policy

<p>Our basic dividend policy is to provide stable dividends based on a progressive and continuous dividend approach. We determine dividends by comprehensively considering the earnings outlook for the current fiscal year and medium to long-term prospects, our financial position, and future business developments. Dividends are paid twice annually as a standard practice, consisting of interim and year-end dividends. We plan to effectively allocate retained earnings toward capital expenditures, research and development, and the establishment of efficient consolidated management systems.</p>

Dividend per Share

Payout Ratio

Dividend Yield

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Dividend History (Forecasts, Revisions, Actuals)

Fiscal YearTypeInterimYear-EndTotalPayout Ratio
FY2026Forecast(2025/05/09)23244730.1%
FY2025Actual(2025/05/09)22234532.8%
Forecast(2024/05/09)22234538.5%
FY2024Actual(2024/05/09)18183635.0%
Forecast(2023/05/10)18183624.1%
FY2023Actual(2023/05/10)14223617.1%
Forecast(2022/05/10)14142819.7%
FY2022Actual(2022/05/10)13.513.52725.2%
Forecast(2021/05/10)13.513.52725.3%
FY2021Actual(2021/05/10)12132532.4%
Forecast(2020/11/02)121325-
FY2020Actual(2020/11/02)121325-
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